US 12,463,119 B2
Semiconductor device and semiconductor device manufacturing method
Akira Sahashi, Yokohama (JP)
Assigned to Sumitomo Electric Device Innovations, Inc., Yokohama (JP)
Filed by Sumitomo Electric Device Innovations, Inc., Yokohama (JP)
Filed on Oct. 4, 2022, as Appl. No. 17/959,472.
Claims priority of application No. 2021-163985 (JP), filed on Oct. 5, 2021.
Prior Publication US 2023/0107764 A1, Apr. 6, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01L 25/07 (2006.01); H01L 23/552 (2006.01)
CPC H01L 23/49568 (2013.01) [H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49531 (2013.01); H01L 23/49562 (2013.01); H01L 23/49565 (2013.01); H01L 23/49575 (2013.01); H01L 23/66 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H01L 23/552 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48155 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/30111 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a package having a top surface and a bottom surface;
a semiconductor element arranged in the package; and
a base arranged in the package and on which the semiconductor element is mounted,
wherein:
the base comprises a lead frame body to which the semiconductor element is mounted, and a plurality of ground terminals provided on a peripheral edge of the lead frame body,
the lead frame body comprises a first heat dissipation region disposed in a center of the lead frame body in plan view and is configured from a columnar region protruding in a direction from the bottom surface toward the top surface of the package, and a second heat dissipation region that is a region surrounding the first heat dissipation region in the plan view,
the plurality of ground terminals contact the second heat dissipation region and extends outwardly,
a top surface of the first heat dissipation region is exposed to the top surface of the package, and
a bottom surface of the second heat dissipation region is exposed to the bottom surface of the package.