US 12,463,110 B2
Laminate substrate with embedded multi-layered heat slug
Bo Zhao, Allen, TX (US); and Alex Arayata, McKinney, TX (US)
Assigned to Qorvo US, Inc., Greensboro, NC (US)
Appl. No. 18/044,230
Filed by Qorvo US, Inc., Greensboro, NC (US)
PCT Filed Sep. 29, 2021, PCT No. PCT/US2021/052531
§ 371(c)(1), (2) Date Mar. 7, 2023,
PCT Pub. No. WO2022/081335, PCT Pub. Date Apr. 21, 2022.
Claims priority of provisional application 63/091,122, filed on Oct. 13, 2020.
Prior Publication US 2023/0326829 A1, Oct. 12, 2023
Int. Cl. H01L 23/373 (2006.01); H01L 23/367 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/3735 (2013.01) [H01L 23/3677 (2013.01); H05K 1/0204 (2013.01); H05K 7/205 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate comprising:
a substrate body having a top surface and a bottom surface opposite the top surface, the substrate body comprising a laminate layer;
a heat slug extending between the top surface and the bottom surface of the substrate body, wherein the heat slug comprises CPC141 having a thickness ratio of 1:4:1, the core layer comprising Mo70Cu30 and wherein the heat slug comprises:
a top layer proximate the top surface of the substrate body, the top layer having a first thermal conductivity and a first thermal expansion coefficient;
a bottom layer proximate the bottom surface of the substrate body, the bottom layer having a second thermal conductivity and a second thermal expansion coefficient;
a core layer between the top layer and the bottom layer, the core layer having a third thermal conductivity and a third thermal expansion coefficient, the third thermal conductivity less than the first thermal conductivity and the second thermal conductivity, and the third thermal expansion coefficient less than the first thermal expansion coefficient and the second thermal expansion coefficient; and
a lid attached to the substrate and forming an air cavity between the substrate and the lid.