US 12,463,106 B2
Electric assembly including heat spreading layer
Jiwoong Kong, Hwaseong-si (KR); and Jung Ju Suh, Seocho-gu (KR)
Assigned to 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
Appl. No. 17/917,070
Filed by 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
PCT Filed Mar. 3, 2021, PCT No. PCT/IB2021/051761
§ 371(c)(1), (2) Date Oct. 5, 2022,
PCT Pub. No. WO2021/205247, PCT Pub. Date Oct. 14, 2021.
Claims priority of application No. 10-2020-0042400 (KR), filed on Apr. 7, 2020.
Prior Publication US 2023/0154817 A1, May 18, 2023
Int. Cl. H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 25/065 (2023.01); H05K 7/20 (2006.01); H01L 23/29 (2006.01)
CPC H01L 23/367 (2013.01) [H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/3736 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 25/0655 (2013.01); H05K 7/20509 (2013.01); H01L 23/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/0665 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic assembly comprising:
a circuit board including a plurality of connection parts having electrical conductivity;
a plurality of spaced apart semiconductor integrated circuits mounted on the circuit board and electrically connected to the plurality of connection parts;
a protective layer disposed on the plurality of semiconductor integrated circuits, substantially surrounding the semiconductor integrated circuits, and having a flat upper surface; and
a heat spreading copper layer disposed on the protective layer, having an average thickness greater than or equal to about 3 microns, and an average grain size greater than about 0.15 micron,
wherein the heat spreading copper layer occupies substantially the same space in a length and a width as the circuit board (coextensive), and
the average thickness of the protective layer is equal to or greater than the height of the plurality of spaced apart semiconductor integrated circuits.