US 12,463,101 B2
Wiring board assembly, wiring board, and wiring board manufacturing method
Yu Karasawa, Nagano (JP); and Ryo Miyazawa, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Jul. 21, 2023, as Appl. No. 18/356,413.
Claims priority of application No. 2022-124328 (JP), filed on Aug. 3, 2022.
Prior Publication US 2024/0047283 A1, Feb. 8, 2024
Int. Cl. H01L 23/13 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/13 (2013.01) [H01L 21/486 (2013.01); H01L 23/49827 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A wiring board assembly comprising:
a wiring structure that includes a wiring layer and an insulating layer; and
an outermost insulating layer that covers a surface of the wiring structure and includes a slit that exposes a predetermined region on the surface of the wiring structure,
wherein
an edge portion of the outermost insulating layer corresponding to an edge portion of the slit meanders in a wave shape so as to include at least a single wave that is selected from among a wave that is formed by a plurality of circular arcs that are connected to one another, a triangular wave, a square wave, and a trapezoidal wave,
the insulating layer located at the surface of the wiring structure is exposed between a plurality of protruding portions included in the edge portion of the outermost insulating layer,
the plurality of protruding portions included in the edge portion of the outermost insulating layer have vertices located at positions that come into contact with a periphery of the predetermined region and bases located inside the periphery of the predetermined region, and
contour lines of the bases of adjacent protruding portions among the plurality of protruding portions intersect each other inside the periphery of the predetermined region in plan view.