US 12,463,100 B2
Semiconductor module
Kisho Ashida, Tokyo (JP); Daisuke Kawase, Hitachi (JP); and Koji Sasaki, Hitachi (JP)
Assigned to HITACHI POWER SEMICONDUCTOR DEVICE, LTD., Ibaraki (JP)
Appl. No. 18/254,412
Filed by Hitachi Power Semiconductor Device, Ltd., Hitachi (JP)
PCT Filed Oct. 15, 2021, PCT No. PCT/JP2021/038246
§ 371(c)(1), (2) Date May 25, 2023,
PCT Pub. No. WO2022/190449, PCT Pub. Date Sep. 15, 2022.
Claims priority of application No. 2021-037996 (JP), filed on Mar. 10, 2021.
Prior Publication US 2024/0006256 A1, Jan. 4, 2024
Int. Cl. H01L 23/053 (2006.01); H01L 23/492 (2006.01)
CPC H01L 23/053 (2013.01) [H01L 23/4924 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
a base;
an insulation substrate bonded to the base;
a semiconductor chip bonded to the insulation substrate; and
a case adhering to the base with an adhesive material, wherein
the base includes a plate-shaped first material and a second material covering the first material and having a linear expansion coefficient larger than a linear expansion coefficient of the first material,
in a case where the base is viewed in a plan view, the second material has first regions arranged at corner portions of the base and a second region arranged at an outer peripheral portion of the base and having a width narrower than a width of each of the first regions,
the case covers at least a part of a side surface of the base and adheres to the base, with the adhesive material, at least on an upper surface of the base, and a linear expansion coefficient of the case is larger than the linear expansion coefficient of the first material,
when a length from a center of a side of the base to an end portion of the base is L1, and a length from the center of the side of the base to a boundary between the first region and the second region is L2, L1−L2 is larger than a plate thickness of the base, and
L3≥L2 or L2−L3≥L1−L2 is satisfied in a case where a length from the center of the side of the base to an end portion on a corner portion side of the base of the adhesive material which adheres the case to the base on the side surface of the base is L3, and L3=0 in a case where there is no adhesive material on the side surface of the base.