| CPC H01L 21/68728 (2013.01) [H01L 21/67754 (2013.01); H01L 21/681 (2013.01); H01L 21/6831 (2013.01)] | 23 Claims |

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1. A wafer locking mechanism configured to lock a wafer, the wafer locking mechanism comprising:
a wafer base, constructed in a form of a frustum shape tapering from a bottom portion thereof towards a top portion thereof, and configured to be elevatable along a direction of an axis thereof;
a plurality of rods, which are diametrically aligned in pairs perpendicular to the axis; and
a plurality of compression springs, which are respectively sheathed on respective distal ends of the plurality of rods distal to the wafer base, in one-to-one correspondence and extend radially outwards,
wherein the plurality of rods are respectively provided with both a plurality of ball-head portions which are located at respective proximal ends thereof proximate to the wafer base and abut against the wafer base, in one-to-one correspondence, and a plurality of jaws which protrude from the respective distal ends along a direction of the axis on a single side of the top portion and are pressed radially inwards by the plurality of compression springs, in one-to-one correspondence;
wherein one rod in each pair of rods in the plurality of rods is provided with an adjusting threaded member, which is located at a respective distal end of the one rod and is screwable to push radially against a respective one of the plurality of compression springs.
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