US 12,463,080 B2
Back grinding adhesive film and method for manufacturing electronic device
Hiroto Yasui, Sodegaura (JP); Hiroyoshi Kurihara, Nagoya (JP); and Jin Kinoshita, Nagoya (JP)
Assigned to MITSUI CHEMICALS ICT MATERIA, INC., Tokyo (JP)
Appl. No. 18/564,794
Filed by MITSUI CHEMICALS ICT MATERIA, INC., Tokyo (JP)
PCT Filed May 27, 2022, PCT No. PCT/JP2022/021680
§ 371(c)(1), (2) Date Nov. 28, 2023,
PCT Pub. No. WO2022/250130, PCT Pub. Date Dec. 1, 2022.
Claims priority of application No. 2021-090288 (JP), filed on May 28, 2021.
Prior Publication US 2024/0274460 A1, Aug. 15, 2024
Int. Cl. H01L 21/683 (2006.01); C09J 7/22 (2018.01); C09J 133/10 (2006.01); H01L 21/304 (2006.01)
CPC H01L 21/6836 (2013.01) [C09J 7/22 (2018.01); C09J 133/10 (2013.01); C09J 2203/326 (2013.01); C09J 2301/122 (2020.08); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2301/416 (2020.08); C09J 2301/50 (2020.08); H01L 21/304 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68386 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film comprising:
a base material layer; and
an adhesive resin layer which is formed on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material,
wherein, regarding the ultraviolet curable adhesive resin material, when a storage elastic modulus at −15° C. is defined as E′ (−15° C.) and a storage elastic modulus at 100° C. is defined as E′ (100° C.) in a case where a viscoelastic characteristic is measured by the following procedures (i) and (ii), E′ (100° C.) is 1.0×106 to 3.5×107 Pa, and E′ (100° C.)/E′ (−15° C.) is 2.0×10−3 to 1.5×10−2,
[Procedures]
(i) a film having a film thickness of 0.2 mm is formed using the ultraviolet curable adhesive resin material, the film is irradiated with an ultraviolet ray having a main wavelength of 365 nm at an irradiation intensity of 100 mW/cm2 with an ultraviolet ray amount of 1,080 mJ/cm2 using a high-pressure mercury lamp in an environment at 25° C. for ultraviolet curing, and a cured film is obtained,
(ii) a dynamic viscoelasticity of the cured film is measured at a frequency of 1 Hz and a temperature of −50° C. to 200° C. in a tensile mode.