US 12,463,079 B2
Dry adhesive for temporary bonding of semiconductor devices
Paul Samuel Glass, Pittsburgh, PA (US); Shree Deshpande, Pittsburgh, PA (US); Justin Bohn, Pittsburgh, PA (US); and Elliot Geikowsky, Pittsburgh, PA (US)
Assigned to Shin-Etsu Chemical Co., Ltd., Tokyo (JP)
Appl. No. 18/015,275
Filed by Shin-Etsu Chemical Co., Ltd., Chiyoda-ku (JP)
PCT Filed Jul. 8, 2021, PCT No. PCT/US2021/040966
§ 371(c)(1), (2) Date Jan. 9, 2023,
PCT Pub. No. WO2022/011193, PCT Pub. Date Jan. 13, 2022.
Claims priority of provisional application 63/049,314, filed on Jul. 8, 2020.
Prior Publication US 2023/0260818 A1, Aug. 17, 2023
Int. Cl. B32B 41/00 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/6836 (2013.01) 17 Claims
OG exemplary drawing
 
1. An apparatus for processing a semiconductor device comprising:
a carrier;
a microfiber array having a plurality of fibers terminating in enlarged tips, wherein the microfiber array is affixed to the carrier, wherein the enlarged tips are adapted to contact a surface of the semiconductor device, wherein the enlarged tips are adapted to release from the semiconductor device through a mechanical movement;
a liquid disposed at an interface between the enlarged tips and the surface of the semiconductor device, wherein the liquid is adapted to increase a force of adhesion of the interface between the enlarged tips and the surface of the semiconductor device.