US 12,463,070 B2
Processing apparatus for electronic component
Hiroyuki Kimura, Fukuoka (JP); and Wataru Hirata, Fukuoka (JP)
Assigned to UENO SEIKI CO., LTD., Fukuoka (JP)
Filed by UENO SEIKI CO., LTD., Fukuoka (JP)
Filed on Mar. 15, 2024, as Appl. No. 18/606,571.
Application 18/606,571 is a continuation of application No. PCT/JP2022/032472, filed on Aug. 29, 2022.
Claims priority of application No. 2021-152325 (JP), filed on Sep. 17, 2021.
Prior Publication US 2024/0222170 A1, Jul. 4, 2024
Int. Cl. H01L 21/67 (2006.01); H01L 21/68 (2006.01); H04N 23/67 (2023.01); G01N 21/01 (2006.01); G06T 7/00 (2017.01); G06T 7/70 (2017.01); H01L 21/677 (2006.01)
CPC H01L 21/67259 (2013.01) [H01L 21/67271 (2013.01); H01L 21/67288 (2013.01); H01L 21/681 (2013.01); H04N 23/67 (2023.01); G01N 21/01 (2013.01); G01N 2201/0415 (2013.01); G06T 7/0004 (2013.01); G06T 7/70 (2017.01); H01L 21/67 (2013.01); H01L 21/677 (2013.01); H01L 21/68 (2013.01); H01L 2224/95121 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A processing apparatus for an electronic component, the apparatus comprising:
a component holding portion including a suction portion configured to hold an electronic component;
a rotation drive unit configured to rotate the suction portion;
a support portion configured to support the component holding portion such that the component holding portion is located on a circular orbit passing through an inspection position;
a transport drive unit configured to rotate the support portion about a central axis of the circular orbit; and
a plurality of processing units provided to correspond to a plurality of stop positions; each processing unit of the plurality of processing units including a visual inspection unit, the transport drive unit being configured to stop the component holding portion at the plurality of stop positions; each visual inspection unit including
an imaging unit configured to image an inspection surface of the electronic component held by the component holding portion disposed at the inspection position;
a position sensor configured to acquire position information indicating a position of the inspection surface of the electronic component held by the component holding portion;
a focus adjustment unit configured to adjust a focus of the imaging unit on the inspection surface based on the position information indicating the position of the inspection surface of the electronic component held by the component holding portion; and
a branch portion,
wherein the position sensor is configured to acquire the position information in a state where the component holding portion that holds the electronic component is disposed at the inspection position, and
wherein the branch portion is configured to branch light from the inspection surface into first light that travels to the imaging unit and second light that travels to the position sensor.