US 12,463,067 B2
Pickup apparatus and method of using the same
Jen-Chun Liao, Taipei (TW); Ching-Hua Hsieh, Hsinchu (TW); Chih-Wei Lin, Hsinchu County (TW); Hsiao-Chung Liang, Hsinchu (TW); and Ying-Jui Huang, Hsinchu County (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 8, 2023, as Appl. No. 18/180,131.
Prior Publication US 2024/0304474 A1, Sep. 12, 2024
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67132 (2013.01) [H01L 21/6836 (2013.01); H01L 2221/68386 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A pickup apparatus for separating a semiconductor package from an adhesive film, comprising:
a platform, having a surface disposed with the adhesive film, wherein the adhesive film is disposed between the platform and the semiconductor package;
a roller, disposed inside the platform and under the adhesive film, wherein the roller comprises:
a body; and
a plurality of protrusions, distributed over the body;
a moving mechanism, connected to the roller to control a movement of the roller; and
a collector element, disposed over the platform and the adhesive film, wherein the collector element is configured to remove the semiconductor package from the adhesive film.