US 12,463,060 B2
Control device, substrate processing system, and method of controlling vacuum valve device
Takuya Yamamoto, Yamanashi (JP); and Takashi Sugimoto, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Jul. 11, 2023, as Appl. No. 18/350,420.
Claims priority of application No. 2022-117477 (JP), filed on Jul. 22, 2022.
Prior Publication US 2024/0030046 A1, Jan. 25, 2024
Int. Cl. H01L 21/67 (2006.01); F16K 31/04 (2006.01); F16K 51/02 (2006.01); H01J 37/32 (2006.01); H02P 8/18 (2006.01)
CPC H01L 21/67017 (2013.01) [F16K 31/047 (2013.01); F16K 51/02 (2013.01); H01J 37/32816 (2013.01); H01L 21/67196 (2013.01); H01L 21/67201 (2013.01); H02P 8/18 (2013.01); H01J 2237/184 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A control device for controlling a vacuum valve device which includes a valve body configured to open and close a transfer path through which a first chamber and a second chamber communicate with each other, a seal member provided in the valve body, and a valve body driver having a motor and configured to drive the valve body,
wherein the control device is configured to be switchable between a first operation pattern for controlling the motor at a first separation speed and a second operation pattern for controlling the motor at a second separation speed lower than the first separation speed.