US 12,463,059 B2
Production method for semiconductor packages
Shizu Fukuzumi, Tokyo (JP); and Naoya Suzuki, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/914,187
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
PCT Filed Jul. 28, 2020, PCT No. PCT/JP2020/028926
§ 371(c)(1), (2) Date Mar. 13, 2023,
PCT Pub. No. WO2021/192341, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 2020-058786 (JP), filed on Mar. 27, 2020.
Prior Publication US 2023/0207334 A1, Jun. 29, 2023
Int. Cl. H01L 21/56 (2006.01); H01L 23/552 (2006.01)
CPC H01L 21/568 (2013.01) [H01L 21/561 (2013.01); H01L 23/552 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for manufacturing a semiconductor package, the method comprising:
(A) forming a temporary fixing material layer on a first surface of a panel member including a plurality of semiconductor packages, circuit surfaces or redistribution layers of the plurality of semiconductor packages being exposed to the first surface;
(B) attaching a first adhesive film to a second surface of the panel member;
(C) singulating the panel member and the temporary fixing material layer on the first adhesive film to obtain a plurality of temporary fixing material piece-attached semiconductor packages;
(D) arranging the plurality of the temporary fixing material piece-attached semiconductor packages on a support carrier so that temporary fixing material pieces of the plurality of temporary fixing material piece-attached semiconductor packages are in contact with the support carrier and a distance between two adjacent of the plurality of temporary fixing material piece-attached semiconductor packages is 0.1 mm or more;
(E) peeling off the first adhesive film from the support carrier and the plurality of temporary fixing material piece-attached semiconductor packages; and
(F) forming a functional layer on surfaces of the plurality of temporary fixing material piece-attached semiconductor packages, which are exposed by peeling off the first adhesive film.