US 12,463,057 B2
Method for producing a base plate
Marco Rasel, Meschede (DE); and Elvis Keli, Bad Sassendorf (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jun. 29, 2021, as Appl. No. 17/362,076.
Claims priority of application No. 20184207 (EP), filed on Jul. 6, 2020.
Prior Publication US 2022/0005708 A1, Jan. 6, 2022
Int. Cl. H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01)
CPC H01L 21/4878 (2013.01) [H01L 21/4871 (2013.01); H01L 23/13 (2013.01); H01L 23/367 (2013.01); H01L 23/49822 (2013.01); Y10T 29/49002 (2015.01)] 11 Claims
OG exemplary drawing
 
1. A method comprising:
producing a base plate, wherein producing the base plate comprises
forming a layer of a metallic material;
forming at least one first area in the layer of metallic material, wherein forming the at least one first area either comprises locally deforming the layer of metallic material, or locally inducing stress into the layer of metallic material, or both such that a deflection or a local stress or both in the at least one first area differs from a deflection or a local stress or both of those areas of the metallic layer surrounding the at least one first area; and
wherein forming the at least one first area in the layer of metallic material comprises locally compressing the layer of metallic material to form at least one local concave deflection.