US 12,463,042 B2
Planarization system and method
Niyaz Khusnatdinov, Round Rock, TX (US)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on May 31, 2022, as Appl. No. 17/829,132.
Prior Publication US 2023/0386849 A1, Nov. 30, 2023
Int. Cl. H01L 21/304 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01)
CPC H01L 21/304 (2013.01) [H01L 21/02074 (2013.01); H01L 21/4842 (2013.01); H01L 21/67092 (2013.01); H01L 21/6833 (2013.01); H01L 21/7687 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A system for forming a layer of formable material on a frontside of a substrate with a superstrate, comprising:
a first conductive portion at a first side of the superstrate, wherein the superstrate having a second side opposite to the first side, and the second side is in contact with the formable material in a case where the superstrate is stacked with the substrate; and
a second conductive portion at a backside of the substrate,
wherein in the case where the superstrate is stacked with the substrate, both the first conductive portion and the second conductive portion are not in contact with the formable material: and
wherein during a separation process in which the superstrate is separated from the formable material on the substrate, both the first conductive portion and the second conductive portion are grounded and the layer of formable material is formed on the frontside of the substrate; and
wherein separating the superstrate from the substrate in a vertical direction in the separation process until the superstrate and the substrate is completely separated and an electric field between the superstrate and the substrate is reduced to a predetermined value; and moving the superstrate in a lateral direction with respect to the substrate.