US 12,463,028 B2
Method of processing wafer
Yoshinobu Saito, Tokyo (JP); Jonghyun Ryu, Tokyo (JP); and Yoshikuni Migiyama, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on May 26, 2022, as Appl. No. 17/804,185.
Claims priority of application No. 2021-092048 (JP), filed on Jun. 1, 2021.
Prior Publication US 2022/0384175 A1, Dec. 1, 2022
Int. Cl. B32B 43/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/02013 (2013.01) [H01L 21/67742 (2013.01); H01L 21/67763 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of processing a wafer, comprising:
a frame preparing step of preparing a ring-shaped frame having an opening for accommodating a wafer therein;
a wafer preparing step of preparing a wafer having a protrusive ring-shaped stiffener on a reverse side thereof in an outer circumferential excess region thereof;
a frame unit producing step of producing a frame unit by affixing a tape to the frame and the reverse side of the wafer;
a center setting step of capturing an image of the ring-shaped stiffener and setting a center of an inner circumferential circle of the ring-shaped stiffener on a basis of the captured image;
a cutting step of rotating the frame unit around the center of the inner circumferential circle of the ring-shaped stiffener to cut the wafer along the inner circumferential circle of the ring-shaped stiffener; and
a stiffener removing step of removing the ring-shaped stiffener severed from the frame unit.
 
4. A method of processing a wafer, comprising:
a frame unit producing step of producing a frame unit by affixing a tape to a frame and a reverse side of the wafer, the frame being a ring-shaped frame having an opening for accommodating the wafer therein, the wafer having a protrusive ring-shaped stiffener on a reverse side thereof in an outer circumferential excess region thereof, the protrusive ring-shaped stiffener being part of the wafer;
capturing an image of the ring-shaped stiffener;
setting a center of an inner circumferential circle of the ring-shaped stiffener on a basis of the captured image;
rotating the frame unit around the center of the inner circumferential circle of the ring-shaped stiffener and cutting the wafer along the inner circumferential circle of the ring-shaped stiffener; and
removing the ring-shaped stiffener severed from the frame unit.