US 12,463,025 B2
Plasma processing apparatus
Kazuki Moyama, Miyagi (JP); and Yuzuru Sakai, Miyagi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jul. 26, 2023, as Appl. No. 18/359,163.
Claims priority of application No. 2022-120799 (JP), filed on Jul. 28, 2022.
Prior Publication US 2024/0047184 A1, Feb. 8, 2024
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32834 (2013.01) [H01J 37/32633 (2013.01); H01J 37/32715 (2013.01); H01J 2237/024 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A plasma processing apparatus comprising:
a plasma processing chamber;
a substrate support disposed in the plasma processing chamber;
a movable member and a stationary member, each disposed around the substrate support, the movable member having a plurality of moving blades, the plurality of moving blades being rotatable, the stationary member having a plurality of stationary blades, the plurality of moving blades and the plurality of stationary blades being alternately disposed along a height direction of the plasma processing chamber, and an exhaust space being formed beneath the movable member and the stationary member;
a first driver configured to rotate the movable member;
a pressure regulating member movably disposed above the movable member and the stationary member, a radially inner portion of the pressure regulating member being disposed radially outside the substrate support; and
a second driver configured to move the pressure regulating member.