US 12,463,023 B2
Member for semiconductor manufacturing apparatus
Tatsuya Kuno, Nagoya (JP); and Seiya Inoue, Handa (JP)
Assigned to NGK INSULATORS, LTD., Nagoya (JP)
Filed by NGK INSULATORS, LTD., Nagoya (JP)
Filed on Feb. 22, 2024, as Appl. No. 18/584,006.
Application 18/584,006 is a continuation of application No. PCT/JP2023/029982, filed on Aug. 21, 2023.
Prior Publication US 2025/0069865 A1, Feb. 27, 2025
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32724 (2013.01) [H01J 37/32642 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A member for semiconductor manufacturing apparatus, comprising:
a ceramic plate including a horizontal and circular wafer placement surface, and a horizontal and annular focus ring placement surface provided on an outer circumference of the wafer placement surface at a position lower than the wafer placement surface by one step, and a connection part that connects the wafer placement surface and the focus ring placement surface; and
a cooling plate provided on a lower surface of the ceramic plate,
wherein the connection part has a lateral surface of a circular truncated cone with a diameter that increases from the wafer placement surface to the focus ring placement surface, and the diameter of the upper surface of the circular truncated cone matches the outer diameter of the wafer placement surface, and the diameter of the lower surface of the circular truncated cone matches the inner diameter of the focus ring placement surface.