US 12,463,021 B2
Substrate processing apparatus and maintenance method for substrate processing apparatus
Hiroki Endo, Miyagi (JP); Nozomu Nagashima, Miyagi (JP); Suguru Sato, Miyagi (JP); Koei Ito, Miyagi (JP); Taisei Seguchi, Miyagi (JP); and Dai Kitagawa, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Sep. 6, 2022, as Appl. No. 17/903,882.
Claims priority of application No. 2021-144494 (JP), filed on Sep. 6, 2021; application No. 2022-049553 (JP), filed on Mar. 25, 2022; and application No. 2022-136129 (JP), filed on Aug. 29, 2022.
Prior Publication US 2023/0071478 A1, Mar. 9, 2023
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32715 (2013.01) [H01J 37/3244 (2013.01); H01J 37/32513 (2013.01); H01J 37/32091 (2013.01)] 31 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a chamber including a sidewall having an opening;
a substrate support disposed in the chamber;
a support member disposed above the substrate support;
an inner wall member having a ceiling portion disposed above the substrate support and below the support member;
a contact member attached to one of the support member and the inner wall member and configured to detachably fix the inner wall member to the support member by applying a spring reaction force to the other of the support member and the inner wall member in a horizontal direction; and
an actuator configured to move the inner wall member downward to release the fixing of the inner wall member to the support member.