US 12,463,015 B2
Substrate processing apparatus and method using the plasma
Dong Hun Kim, Seoul (KR); Da Som Bae, Seoul (KR); Wan Jae Park, Gyeonggi-do (KR); Seong Gil Lee, Gyeonggi-do (KR); Young Je Um, Busan (KR); Ji Hwan Lee, Incheon (KR); Dong Sub Oh, Busan (KR); Myoung Sub Noh, Gyeonggi-do (KR); Joun Taek Koo, Seoul (KR); and Du Ri Kim, Seoul (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Apr. 1, 2022, as Appl. No. 17/712,035.
Prior Publication US 2023/0317415 A1, Oct. 5, 2023
Int. Cl. H01J 37/32 (2006.01); H01L 21/3065 (2006.01)
CPC H01J 37/3244 (2013.01) [H01J 37/32422 (2013.01); H01J 37/32568 (2013.01); H01L 21/3065 (2013.01); H01J 2237/334 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate comprising:
a processing space, in which a substrate is disposed; and
a plasma generating module for generating plasma for processing the substrate,
wherein the plasma generating module comprises,
a plurality of first electrodes disposed in parallel with each other in a first direction,
a plurality of second electrodes disposed in parallel with each other in a second direction different from the first direction, and
an array including a plurality of micro plasma cells, wherein each micro plasma cell is connected to corresponding first electrode and second electrode, and generates plasma according a first voltage applied to the corresponding first electrode and a second voltage applied to the corresponding second electrode,
wherein the plurality of micro plasma cells are positioned between the first electrodes and the second electrodes, wherein each of the plurality of micro plasma cells overlaps a corresponding first electrode and a corresponding second electrode.