US 12,463,013 B2
Plasma processing apparatus
Taro Ikeda, Nirasaki (JP); Yuki Osada, Nirasaki (JP); and Hiroyuki Miyashita, Nirasaki (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Feb. 22, 2024, as Appl. No. 18/583,943.
Claims priority of application No. 2023-031114 (JP), filed on Mar. 1, 2023.
Prior Publication US 2024/0297020 A1, Sep. 5, 2024
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32256 (2013.01) [H01J 37/3222 (2013.01); H01J 37/32238 (2013.01); H01J 37/32293 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A plasma processing apparatus, comprising:
a processing container;
a resonator configured to resonate electromagnetic waves to be supplied;
a slot antenna connected to the resonator; and
a transmission window configured to transmit the electromagnetic waves radiated from the slot antenna and supply the electromagnetic waves into the processing container,
wherein the resonator includes:
an input port including an inner shaft and an outer cylinder;
an output port including an inner shaft and an outer cylinder;
a power supply fin connecting the inner shaft of the input port and the inner shaft of the output port and provided in the resonator; and
a ground fin connected to the outer cylinder of the input port and the outer cylinder of the output port at a same potential and provided to protrude within the resonator so as to be inserted between fins of the power supply fin.