US 12,462,982 B2
Multilayer ceramic electronic component, method of manufacturing the same, and circuit board
Tomoki Sakai, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Mar. 29, 2023, as Appl. No. 18/192,515.
Claims priority of application No. 2022-065487 (JP), filed on Apr. 12, 2022.
Prior Publication US 2023/0326682 A1, Oct. 12, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/005 (2006.01); H01G 4/12 (2006.01); H05K 1/16 (2006.01)
CPC H01G 4/306 (2013.01) [H01G 4/005 (2013.01); H01G 4/12 (2013.01); H05K 1/162 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component comprising:
a ceramic body that has a plurality of internal electrodes stacked in a direction of a first axis, and end surfaces perpendicular to a second axis orthogonal to the first axis, the plurality of internal electrodes being alternately led out to the end surfaces; and
external electrodes covering the end surfaces of the ceramic body, respectively,
wherein each of the external electrodes includes:
a base film formed on a corresponding one of the end surfaces and connected to the plurality of internal electrodes that are led out to the corresponding end surface,
a first Ni film formed on the base film,
a metal film that is formed on the first Ni film and contains a metal having a lower ionization tendency than Ni, as a main component,
a second Ni film formed on the metal film and having a hydrogen concentration higher than that of the first Ni film, and
a surface layer film formed on the second Ni film.