| CPC H01G 4/2325 (2013.01) [H01G 4/30 (2013.01); H01G 4/248 (2013.01)] | 12 Claims |

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1. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a 1-1-th electrode layer disposed on the third surface, and a 1-2-th electrode layer disposed on the first and second surfaces and connected to the 1-1-th electrode layer; and
a second external electrode including a 2-1-th electrode layer disposed on the fourth surface and a 2-2-th electrode layer disposed on the first and second surfaces and connected to the 2-1-th electrode layer,
wherein the 1-2-th electrode layer and the 2-2-th electrode layer include Cu and a first additive element having a content lower than a content of the Cu,
the content of the first additive element included in the 1-2-th electrode layer is greater than the content of the first additive element included in the 1-1-th electrode layer, and the content of the first additive element included in the 2-2-th electrode layer is greater than the content of the first additive element included in the 2-1-th electrode layer, and
the first additive element is at least one selected from Ag or Al.
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