US 12,462,964 B2
Coil component, circuit board, electronic device, and method of manufacturing coil component
Hitoshi Matsuura, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Feb. 2, 2022, as Appl. No. 17/591,332.
Claims priority of application No. 2021-030452 (JP), filed on Feb. 26, 2021.
Prior Publication US 2022/0277884 A1, Sep. 1, 2022
Int. Cl. H01F 27/28 (2006.01); H01F 1/147 (2006.01); H01F 27/255 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01)
CPC H01F 27/255 (2013.01) [H01F 1/14766 (2013.01); H01F 27/2823 (2013.01); H01F 41/0246 (2013.01); H01F 41/04 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A coil component comprising:
a coil conductor extending around a coil axis; and
a magnetic base body disposed to intersect the coil axis, the magnetic base body including first metal magnetic particles, second metal magnetic particles, and magnetic gap portions, each of the first metal magnetic particles having a first elastic limit and a first relative permeability, each of the second metal magnetic particles having a second elastic limit smaller than the first elastic limit and a second relative permeability lower than the first relative permeability, each of the magnetic gap portions covering a surface of associated one of the first metal magnetic particles and configured such that a first thickness of the magnetic gap portion in a first direction along the coil axis is larger than a second thickness of the magnetic gap portion in a second direction perpendicular to the first direction.