US 12,462,962 B2
Surface-mounted magnetic-component module
Lee Francis, Milton Keynes (GB)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Appl. No. 17/568,853
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
PCT Filed Jul. 9, 2020, PCT No. PCT/US2020/041355
§ 371(c)(1), (2) Date Jan. 5, 2022,
PCT Pub. No. WO2021/007406, PCT Pub. Date Jan. 14, 2021.
Claims priority of provisional application 62/871,854, filed on Jul. 9, 2019.
Prior Publication US 2022/0310300 A1, Sep. 29, 2022
Int. Cl. H01F 27/02 (2006.01); H01F 27/26 (2006.01); H01F 27/30 (2006.01)
CPC H01F 27/022 (2013.01) [H01F 27/266 (2013.01); H01F 27/306 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A magnetic-component module comprising:
a first header is a molded header;
a core on the first header; and
a winding including a first trace and an additional trace on the first header; wherein the first header includes:
a disc-shaped portion that extends only along on a bottom surface of the core and that supports the core;
standoffs extending from the disc-shaped portion; and
a cylinder-shaped portion that receives a hole of the core,
the first trace extends along the disc-shaped portion adjacent a bottom surface of the core and extends along the cylinder-shaped portion adjacent an inner surface of the core, and
the additional trace extends from a top side of the first header to a bottom side of a corresponding standoff of the standoffs such that the additional trace electrically connects to a pad on a substrate, when the first header is connected to the substrate.