US 12,462,957 B2
Thermal protection device to withstand high voltage
Toshikazu Yamaoka, Tokyo (JP); Yohei Mizukami, Chicago, IL (US); Jianhua Chen, Chicago, IL (US); and Werner Johler, Chicago, IL (US)
Assigned to Littelfuse, Inc., Rosemont, IL (US)
Filed by Littelfuse, Inc., Chicago, IL (US)
Filed on Jan. 25, 2023, as Appl. No. 18/101,357.
Claims priority of provisional application 63/305,901, filed on Feb. 2, 2022.
Prior Publication US 2023/0245804 A1, Aug. 3, 2023
Int. Cl. H01C 7/02 (2006.01); H05B 3/14 (2006.01)
CPC H01C 7/02 (2013.01) [H05B 3/141 (2013.01); H05B 2203/02 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A thermal protection circuit, comprising:
a first PTC device, arranged in a PTC circuit, and having a first input side, coupled to an input path of the PTC circuit, and having a first output side, coupled to an output path of the PTC circuit;
a second PTC device, arranged in the PTC circuit, and having a second input side, coupled to the input path of the PTC circuit, and having a second output side, coupled to the output path of the PTC circuit; and
a thermal link having a third input side, coupled to the first output side of the first PTC device and the second output side of the second PTC device, via the output path of the PTC circuit;
wherein the first PTC device comprises a first trip temperature PTCT1, wherein the second PTC device comprises a second trip temperature PTCT2, wherein the thermal link comprises a melting temperature TM, wherein PTCT1, <TM.<PTCT2.