US 12,462,887 B2
Memory device included in memory system and method for detecting fail memory cell thereof
Jungmin Bak, Suwon-si (KR); Junyoung Ko, Suwon-si (KR); and Changhwi Park, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jun. 12, 2023, as Appl. No. 18/332,948.
Claims priority of application No. 10-2022-0110531 (KR), filed on Sep. 1, 2022; and application No. 10-2022-0167045 (KR), filed on Dec. 2, 2022.
Prior Publication US 2024/0079074 A1, Mar. 7, 2024
Int. Cl. G11C 29/14 (2006.01); G11C 7/10 (2006.01); G11C 29/02 (2006.01); G11C 29/52 (2006.01); G11C 29/12 (2006.01)
CPC G11C 29/022 (2013.01) [G11C 7/1096 (2013.01); G11C 29/14 (2013.01); G11C 29/52 (2013.01); G11C 2029/1202 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory device comprising:
a memory cell array including a plurality of memory cells;
a word line defect detection circuit electrically connected to the memory cell array through a plurality of word lines; and
control logic configured to control an input/output operation of the memory cell array, and
wherein, responsive to receiving a memory defect detection command from a memory controller, the word line defect detection circuit is configured to provide an input voltage to a selected word line among the plurality of word lines, and to generate a fail flag based on a difference between a voltage of the selected word line and a reference voltage, and
wherein, responsive to receiving a mode register read command from the memory controller, the control logic is configured to transmit the fail flag and a fail row address corresponding to the fail flag to the memory controller.