US 12,462,833 B1
Alternative alignment technique for semiconductor device transfer print process
Sayak Ghoshal, Londonderry (GB)
Assigned to SEAGATE TECHNOLOGY LLC, Fremont, CA (US)
Filed by Seagate Technology LLC, Fremont, CA (US)
Filed on Apr. 27, 2023, as Appl. No. 18/308,519.
Claims priority of provisional application 63/366,856, filed on Jun. 23, 2022.
Int. Cl. G11B 5/127 (2006.01); G11B 5/00 (2006.01)
CPC G11B 5/1272 (2013.01) [G11B 2005/0021 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of aligning a semiconductor device for use in a storage device, the method comprising the steps of:
providing a semiconductor device on a first substrate, wherein the first substrate includes a first alignment mark;
providing a recording head on a second substrate, wherein the second substrate includes a second alignment mark;
providing a transfer print head, wherein the transfer print head includes a third alignment mark;
aligning the transfer print head to the semiconductor device on the first substrate; and
transfer printing the semiconductor device from the first substrate onto the second substrate, wherein the transfer printing includes aligning the third alignment mark on the transfer print head to the second alignment mark on the second substrate.