US 12,462,370 B2
System for predicting properties of structures, imager system, and related methods
Amitava Majumdar, Boise, ID (US); Qianlan Liu, Boise, ID (US); Pradeep Ramachandran, Lehi, UT (US); Shawn D. Lyonsmith, Boise, ID (US); Steve K. McCandless, Nampa, ID (US); Ted L. Taylor, Boise, ID (US); Ahmed N. Noemaun, Boise, ID (US); and Gordon A. Haller, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jan. 8, 2024, as Appl. No. 18/406,485.
Application 18/406,485 is a division of application No. 17/117,222, filed on Dec. 10, 2020, granted, now 11,869,178.
Application 17/117,222 is a division of application No. 16/100,729, filed on Aug. 10, 2018, granted, now 10,872,403, issued on Dec. 22, 2020.
Prior Publication US 2024/0153062 A1, May 9, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G06T 7/00 (2017.01); G01B 1/00 (2006.01); G01B 11/00 (2006.01); G01N 21/21 (2006.01); G01N 21/47 (2006.01); G06F 30/367 (2020.01); G06N 20/00 (2019.01)
CPC G06T 7/0004 (2013.01) [G01B 1/00 (2013.01); G01B 11/00 (2013.01); G01N 21/211 (2013.01); G01N 21/4738 (2013.01); G06F 30/367 (2020.01); G06N 20/00 (2019.01); G01B 2210/56 (2013.01); G06T 2207/10024 (2013.01); G06T 2207/10152 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/30148 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
receiving first image data relating to at least one first wafer lot from an imager system;
receiving measured metrology data relating to the at least one first wafer lot from metrology equipment;
applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots; and
utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the at least one first wafer lot,
wherein the first image data comprises color data corresponding to features of each wafer of the at least one first wafer lot represented in the first image data.