US 12,462,367 B2
Defect detection method and terminal device
Wan-Hsin Tarng, New Taipei (TW); Cheng-Ju Yang, Taipei (TW); and Tsai-Ping Chu, New Taipei (TW)
Assigned to Fulian Precision Electronics (Tianjin) Co., LTD., Tianjin (CN)
Filed by Fulian Precision Electronics (Tianjin) Co., LTD., Tianjin (CN)
Filed on Apr. 27, 2023, as Appl. No. 18/140,588.
Claims priority of application No. 202211129065.7 (CN), filed on Sep. 16, 2022.
Prior Publication US 2024/0095900 A1, Mar. 21, 2024
Int. Cl. G06T 7/00 (2017.01); B23K 37/00 (2006.01); G06T 7/136 (2017.01); G06T 7/194 (2017.01)
CPC G06T 7/0004 (2013.01) [B23K 37/00 (2013.01); G06T 7/136 (2017.01); G06T 7/194 (2017.01); G06T 2207/30141 (2013.01); G06T 2207/30152 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A defect detection method applied to a terminal device, the terminal device communicable with a solder paste inspection (SPI) machine, the defect detection method comprising:
obtaining an image of a first defective block output by the SPI machine; wherein the first defective block is a solder paste block that is not qualified for printing after being detected by the SPI machine;
performing binarization processing on the image of the first defective block to obtain a solder paste mask block and expanding the image of the first defective block to fill a gap in the solder paste mask block;
detecting whether solder paste printing in the first defective block is qualified;
determining that the first defective block is a second defective block and determining a defect type of the first defective block when the solder paste printing of the first defective block is not qualified;
detecting whether the solder paste printing in the first defective block is outside a boundary of a first detection area; detecting whether there is a tin bridge in the first defective block when the solder paste printing in the first defective block is outside the boundary of the first detection area; detecting whether a solder paste area in the first defective block meets a standard area range when the solder paste printing in the first defective block is within the boundary of the first detection area;
determining that the first defective block is the second defective block, determining that the defect type of the second defective block is a first type when the tin bridge is detected in the first defective block, detecting whether the solder paste printing of the first defective block is offset when the tin bridge is not detected in the first defective block; and
detecting whether the solder paste printing in the first defective block is offset by detecting whether a coverage of a solder paste in the first defective block within a second detection area is greater than or equal to a standard coverage rate; wherein the second detection area is obtained by reducing the first detection area by a first ratio.