US 12,462,264 B2
Systems and methods for applying an identification pattern to an electronic device
Alex A. Olson, Pullman, WA (US); Harold R. Klein, Pullman, WA (US); and Cody W. Tews, Portland, OR (US)
Assigned to Schweitzer Engineering Laboratories, Inc., Pullman, WA (US)
Filed by Schweitzer Engineering Laboratories, Inc., Pullman, WA (US)
Filed on May 17, 2023, as Appl. No. 18/319,218.
Prior Publication US 2024/0386446 A1, Nov. 21, 2024
Int. Cl. G06Q 30/018 (2023.01); G06F 16/583 (2019.01)
CPC G06Q 30/0185 (2013.01) [G06F 16/5854 (2019.01)] 19 Claims
OG exemplary drawing
 
1. A method of manufacture, comprising:
coupling a plurality of electronic components to a printed circuit board (PCB);
applying an identification pattern over the plurality of electronic components coupled to the PCB, wherein applying the identification pattern comprises outputting a coating of material onto the plurality of electrical components;
capturing an image of the identification pattern applied over the plurality of electronic components coupled to the PCB;
associating the image with an additional identification pattern associated with the PCB; and
storing the image and the association between the image and the additional identification pattern in a database.