US 12,462,139 B2
RFID tag
Akihiko Saito, Inagi (JP); Yasunao Mizutani, Inagi (JP); Yoshiyasu Sugimura, Inagi (JP); Tsuyoshi Niwata, Inagi (JP); Mimpei Miura, Inagi (JP); Hideo Miyazawa, Inagi (JP); and Mao Kikukawa, Inagi (JP)
Assigned to FUJITSU FRONTECH LIMITED, Tokyo (JP)
Filed by FUJITSU FRONTECH LIMITED, Inagi (JP)
Filed on Jul. 25, 2023, as Appl. No. 18/358,412.
Application 18/358,412 is a continuation of application No. PCT/JP2021/006003, filed on Feb. 17, 2021.
Prior Publication US 2024/0046061 A1, Feb. 8, 2024
Int. Cl. G06K 19/077 (2006.01)
CPC G06K 19/07773 (2013.01) [G06K 19/0776 (2013.01)] 1 Claim
OG exemplary drawing
 
1. An RFID tag comprising:
a substrate;
an IC chip disposed on a first face of the substrate;
a conductive adhesive that is positioned around the IC chip along the first face and fixes the IC chip to the substrate;
a reinforcing material provided on the first face of the substrate in order to protect the IC chip, where the reinforcing material is provided only in a part of the first face of the substrate that includes a position covering the IC chip and the conductive adhesive;
an antenna pattern formed in a loop shape on a second face of the substrate, the second face being opposite to the first face; and
at least one through hole that penetrates the substrate and communicates with the antenna pattern and the conductive adhesive in an area covered by the reinforcing material around the IC chip and electrically connects the antenna pattern with the IC chip, wherein
the antenna pattern has two ends facing each other with a gap at a position of the second face of the substrate, the position facing away from the IC chip, and
the at least one through hole comprises only two through holes that electrically connect the two respective ends of the antenna pattern with the IC chip.