US 12,461,618 B2
Display substrate, method for manufacturing same, and display device
Zhaowei Yu, Beijing (CN); Qinhe Wei, Beijing (CN); Rongjian Yan, Beijing (CN); and Wenbin Chen, Beijing (CN)
Assigned to Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and Beijing BOE Technology Development CO., Ltd., Beijing (CN)
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Filed on Mar. 26, 2024, as Appl. No. 18/617,645.
Application 18/617,645 is a continuation of application No. 17/486,827, filed on Sep. 27, 2021, granted, now 11,983,340.
Claims priority of application No. 202011063528.5 (CN), filed on Sep. 30, 2020.
Prior Publication US 2024/0231529 A1, Jul. 11, 2024
Int. Cl. H10K 50/84 (2023.01); G06F 3/041 (2006.01); H10K 59/122 (2023.01); H10K 59/124 (2023.01); H10K 59/40 (2023.01); H10K 71/00 (2023.01); H10K 77/10 (2023.01); H10K 59/80 (2023.01)
CPC G06F 3/0412 (2013.01) [H10K 50/84 (2023.02); H10K 59/122 (2023.02); H10K 59/124 (2023.02); H10K 59/40 (2023.02); H10K 71/00 (2023.02); H10K 77/111 (2023.02); H10K 59/873 (2023.02)] 19 Claims
OG exemplary drawing
 
1. A display substrate, comprising:
a base substrate;
a pixel defining layer disposed on the base substrate, wherein the pixel defining layer comprises a plurality of barriers and defines a plurality of sub-pixel areas, and some or all of the barriers have grooves therein;
a light-emitting unit, disposed in the plurality of sub-pixel areas;
an encapsulating structure, disposed on a side of the light-emitting unit distal from the base substrate, wherein the encapsulating structure comprises at least a first inorganic sub-layer, an organic sub-layer and a second inorganic sub-layer laminated in a direction going distal from the base substrate, the encapsulating structure covers the grooves of the pixel defining layer, wherein a portion of at least one layer of the encapsulating structure for covering the grooves forms a depression; and
a touch structure, comprising a first connecting line disposed in the depression and a second connecting line disposed on a side of the first connecting line distal from the base substrate;
wherein at least one layer of the encapsulating structure is in direct contact with a surface of the second connecting line distal from the base substrate, a surface of the at least one layer close to the base substrate comprises a non-flat surface, and a vertical distance from a portion of a surface of the at least one layer covering the second connecting line to the base substrate is different from a vertical distance from a portion of a surface of the at least one layer covering the sub-pixel area to the base substrate.