US 12,461,502 B2
Mean time between failure of semiconductor- fabrication equipment using data analytics with natural-language processing
Arya Priya Bhattacherjee, Livermore, CA (US); David Harrison Webster, Los Altos, CA (US); and Scott Michael Braun, San Jose, CA (US)
Assigned to Lavorro, Inc., Palo Alto, CA (US)
Filed by Lavorro, Inc., Palo Alto, CA (US)
Filed on Jul. 19, 2022, as Appl. No. 17/868,698.
Claims priority of provisional application 63/223,911, filed on Jul. 20, 2021.
Prior Publication US 2023/0024507 A1, Jan. 26, 2023
Int. Cl. G05B 19/18 (2006.01); G06F 40/279 (2020.01); G06F 40/35 (2020.01); G10L 15/18 (2013.01); G10L 15/22 (2006.01)
CPC G05B 19/188 (2013.01) [G06F 40/279 (2020.01); G06F 40/35 (2020.01); G10L 15/1815 (2013.01); G10L 15/22 (2013.01); G05B 2219/45031 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system comprising:
a wafer handling system configured to hold one or more wafers for processing;
wafer processing components configured to physically treat the one or more wafers;
a controller in communication with the wafer processing components and configured to operate the wafer processing components;
a virtual assistant, in communication with a natural language processing (NLP) engine and with the wafer processing components, configured to;
receive, from a user, a user query related to at least one wafer processing component of the wafer processing components, and
understand an intent or context of the user query by extracting, from the user query, entities corresponding to the at least one wafer processing component and identifying a relationship between the extracted entities; and
a data-analytics engine configured to:
obtain data relating to the intent or context of the user query based by predicting relevant data from data collected from the wafer processing components via one or more communication protocols based on the extracted entities and the identified relationship, and
generate analytic data by analyzing the obtained data and provide the analytic data to the virtual assistant,
wherein the virtual assistant is further configured to: identify a cause of yield loss in the wafer processing components based on the analytic data and provide a context-specific response to the user query that comprises information for operating one or more of the wafer processing components to increase yield.