US 12,461,457 B2
Asymmetry extended grid model for wafer alignment
Joshua Adams, Wilton, CT (US); Leonardo Gabriel Montilla, Norwalk, CT (US); Nick Franciscus Wilhelmus Thissen, Eindhoven (NL); Leendert Jan Karssemeijer, 's Hertogenbosch (NL); Igor Matheus Petronella Aarts, Port Chester, NY (US); and Zahrasadat Dastouri, Norwalk, CT (US)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Appl. No. 18/552,623
Filed by ASML Netherlands B.V., Veldhoven (NL)
PCT Filed Mar. 21, 2022, PCT No. PCT/EP2022/057355
§ 371(c)(1), (2) Date Sep. 26, 2023,
PCT Pub. No. WO2022/207395, PCT Pub. Date Oct. 6, 2022.
Claims priority of provisional application 63/167,538, filed on Mar. 29, 2021.
Prior Publication US 2024/0168397 A1, May 23, 2024
Int. Cl. G03F 7/20 (2006.01); G01B 9/02055 (2022.01); G01B 11/16 (2006.01); G01B 11/27 (2006.01); G03F 7/00 (2006.01); G03F 9/00 (2006.01)
CPC G03F 9/7049 (2013.01) [G01B 9/02062 (2013.01); G01B 11/161 (2013.01); G01B 11/272 (2013.01); G03F 7/70616 (2013.01); G03F 7/706841 (2023.05); G03F 9/7065 (2013.01); G03F 9/7088 (2013.01); G03F 9/7092 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A metrology system, comprising:
an illumination system configured to generate light;
a reflector configured to direct the light towards a substrate;
an interferometer configured to:
receive light diffracted from a plurality of alignment marks disposed on the substrate or reflected from the substrate, and
generate output light from an interference between the received light;
a detector configured to:
receive the output light from the interferometer, and
generate a measurement data signal based on the received output light; and a controller configured to:
determine substrate deformation data based on the measurement data signal,
determine alignment mark deformation data based on the measurement data signal, wherein the alignment mark deformation data comprises alignment mark deformation spectral pattern data, alignment mark deformation amplitude data, and alignment mark deformation offset data, and
determine a correction to the measurement data signal based on the substrate deformation data and the alignment mark deformation data.