US 12,461,454 B2
Semiconductor processing tool and method of using the same
Tzu-Jung Pan, Hsinchu (TW); Sheng-Kang Yu, Hsinchu (TW); Shang-Chieh Chien, New Taipei (TW); Heng-Hsin Liu, New Taipei (TW); and Li-Jui Chen, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 23, 2022, as Appl. No. 17/652,169.
Claims priority of provisional application 63/202,615, filed on Jun. 17, 2021.
Prior Publication US 2022/0404722 A1, Dec. 22, 2022
Int. Cl. G03F 7/20 (2006.01); G03F 7/00 (2006.01); H05G 2/00 (2006.01)
CPC G03F 7/70916 (2013.01) [G03F 7/70033 (2013.01); H05G 2/0094 (2024.08)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
receiving, at a control device, an indication of levels of tin contamination on a surface of an extreme ultraviolet (EUV) tool;
controlling, independently, flow rates associated with a first plurality of hydrogen outlets based on the indication, wherein the first plurality of hydrogen outlets are arrayed along a direction normal to the surface; and
controlling movement associated with a first hydrogen outlet of the first plurality of hydrogen outlets based on the indication using a first command provided to a first movement mechanism corresponding to the first hydrogen outlet.