US 12,461,451 B2
Computational metrology
Patrick Warnaar, Tilburg (NL); Patricius Aloysius Jacobus Tinnemans, Hapert (NL); Grzegorz Grzela, Eindhoven (NL); Everhardus Cornelis Mos, Best (NL); Wim Tjibbo Tel, Helmond (NL); Marinus Jochemsen, Veldhoven (NL); Bart Peter Bert Segers, Tessenderlo (BE); and Frank Staals, Eindhoven (NL)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
Filed on Jul. 19, 2021, as Appl. No. 17/379,662.
Application 17/379,662 is a continuation of application No. 16/635,584, granted, now 11,067,902, previously published as PCT/EP2018/068786, filed on Jul. 11, 2018.
Claims priority of application No. 17185116 (EP), filed on Aug. 7, 2017; and application No. 18161406 (EP), filed on Mar. 13, 2018.
Prior Publication US 2021/0349395 A1, Nov. 11, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/705 (2013.01) [G03F 7/70625 (2013.01); G03F 7/70633 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
obtaining a distribution, across at least part of a substrate, of one or more parameters of a patterning process of each particular feature of a plurality of features of a device pattern of the substrate, each distribution relating values of the one or more parameters for the respective feature to locations on the substrate and the patterning process used to create the device pattern; and
causing, by a hardware computer system and based on the distributions, physical design, physical control or physical modification of the patterning process.