US 12,461,447 B2
Optical assembly with coating and methods of use
Wei-Hao Lee, Hsinchu (TW); Pei-Cheng Hsu, Hsinchu (TW); Huan-Ling Lee, Hsinchu (TW); Ta-Cheng Lien, Hsinchu (TW); Hsin-Chang Lee, Hsinchu (TW); and Chin-Hsiang Lin, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on May 16, 2022, as Appl. No. 17/745,576.
Claims priority of provisional application 63/283,088, filed on Nov. 24, 2021.
Prior Publication US 2023/0161261 A1, May 25, 2023
Int. Cl. G03F 7/00 (2006.01); G03F 1/62 (2012.01)
CPC G03F 7/70033 (2013.01) [G03F 1/62 (2013.01); G03F 7/70983 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
generating extreme ultraviolet (EUV) radiation in an EUV lithography system;
passing the EUV radiation through a coating layer of a pellicle membrane, the coating layer including one or more compounds selected from non-metal carbide compounds, non-metal silicide compounds, transition metal carbide compounds and transition metal silicide compounds that exhibit a ratio of EUV % transmittance to thickness in nanometers between 40 and 10;
passing the EUV radiation that has passed through the coating layer through a transparent layer of the pellicle membrane, the transparent layer comprising a plurality of nanotubes, the plurality of nanotubes including nanotubes having a core shell structure;
reflecting the EUV radiation that has passed through the transparent layer from a mask; and
receiving the EUV radiation, reflected by the mask, at a semiconductor substrate to expose a resist layer disposed thereon.