| CPC G02B 6/4269 (2013.01) [H05K 1/0203 (2013.01); H05K 7/20136 (2013.01); G02B 6/4256 (2013.01); H04B 1/036 (2013.01); H05K 7/20145 (2013.01); H05K 7/20154 (2013.01)] | 20 Claims |

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1. An optical module, comprising:
a housing that includes an opening,
wherein the opening is configured to enable an airflow path that is along a length of the optical module;
a circuitry component disposed within the housing, the circuitry component comprising an optical subassembly and a digital signal processor;
a first heatsink above the optical subassembly,
wherein the first heatsink is connected to the optical subassembly and separated from the housing; and
a second heatsink above the digital signal processor,
wherein the second heatsink is connected to the housing and separated from the first heatsink, and
wherein the first heatsink and the second heatsink are configured to be positioned adjacent to each other along the length of the optical module, along a direction of the airflow path.
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