US 12,461,314 B2
Modular assembly for opto-electronic systems
Po Dong, Cupertino, CA (US); Juthika Basak, San Jose, CA (US); and Jiashu Chen, Cupertino, CA (US)
Assigned to II-VI DELAWARE, INC., Wilmington, DE (US)
Filed by II-VI Delaware, Inc., Wilmington, DE (US)
Filed on Dec. 8, 2023, as Appl. No. 18/534,211.
Application 17/991,262 is a division of application No. 17/097,250, filed on Nov. 13, 2020, granted, now 11,543,592, issued on Jan. 3, 2023.
Application 18/534,211 is a continuation of application No. 17/991,262, filed on Nov. 21, 2022, granted, now 11,874,502.
Prior Publication US 2024/0103225 A1, Mar. 28, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 6/30 (2006.01); G02B 6/42 (2006.01)
CPC G02B 6/30 (2013.01) [G02B 6/421 (2013.01); G02B 6/4249 (2013.01); G02B 6/4274 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A system integrating a fiber block and a photonic integrated circuit (PIC) chip, the system comprising:
a waveguide (WG) chip disposed on a substrate between the fiber block and the PIC chip, the WG chip having a plurality of waveguides configured to transmit optical signals; and
mechanical structures for aligning the PIC chip and the WG chip, wherein:
the WG chip includes a first facet comprising a first light coupling surface providing a first light coupling with the fiber block by the plurality of waveguides and a second facet having a second light coupling surface providing a second light coupling with the PIC chip by the plurality of waveguides, and
the plurality of waveguides of the WG chip are configured to be coupled to second waveguides embedded between upper and lower surfaces of the PIC chip at the second light coupling surface,
each of the plurality of waveguides includes a first end disposed at the first light coupling surface and a second end disposed at the second light coupling surface, the first ends being respectively offset vertically from the second ends.