US 12,461,304 B2
Optical packaging features for mechanical stability and optical fiber coupling
Aparna R. Prasad, San Jose, CA (US); Norbert Schlepple, Macungie, PA (US); Vipulkumar K. Patel, Breinigsville, PA (US); and Arturo Pachon Munoz, San Jose, CA (US)
Assigned to Cisco Technology, Inc., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Feb. 7, 2023, as Appl. No. 18/165,844.
Prior Publication US 2024/0264370 A1, Aug. 8, 2024
Int. Cl. G02B 6/12 (2006.01); G02B 6/13 (2006.01)
CPC G02B 6/12004 (2013.01) [G02B 6/13 (2013.01); G02B 2006/12061 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An optical platform comprising:
a first layer positioned on a substrate and comprising a first thickness from a first side of the first layer adjacent to the substrate to a second side of the first layer;
a first plurality of conductive paths formed in the first layer;
a second layer positioned on the first layer and comprising a second thickness from a first side of the second layer adjacent to the second side of the first layer to a second side of the second layer, where the first thickness is greater than the second thickness, where the first thickness and the second thickness provide a combined mechanical coupling thickness for an optical connection component on an facet edge side of the first layer and the second layer; and
a second plurality of conductive paths formed through the second layer, where the second plurality of conductive paths provides communication paths from the second side of the second layer to the first plurality of conductive paths,
wherein the facet edge side comprises a diced smooth facet surface, and wherein the optical platform further comprises a fiber array unit (FAU) removably or permanently attached to the facet edge side, wherein the FAU is communicatively coupled to the second layer.