| CPC G01R 31/2806 (2013.01) | 17 Claims |
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1. A test device comprising:
a main board;
first and second device under test (DUT) boards disposed on the main board, wherein first and second semiconductor devices are mounted on the first and second DUT boards, respectively, the first and second semiconductor devices are DUTs; and
first and second connectors respectively disposed at a first end and a second end of the first DUT board, the first and second connectors are spaced apart from each other and respectively transmit first and second signals,
wherein the first signal forms a first electrical path along which the first signal is input to the first DUT board via the first connector, and the second signal forms a second electrical path along which the second signal is output from the first DUT board and input to the second DUT board via the second connector,
wherein a connection board including the second connector is disposed between the second end of the first DUT board and a first end of the second DUT board, and
wherein the connection board is spaced apart from the main board.
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