US 12,460,976 B2
Integrated thermocouple
Yaojian Leng, Vancouver, WA (US)
Assigned to Microchip Technology Incorporated, Chandler, AZ (US)
Filed by Microchip Technology Incorporated, Chandler, AZ (US)
Filed on Mar. 10, 2023, as Appl. No. 18/120,093.
Claims priority of provisional application 63/349,322, filed on Jun. 6, 2022.
Prior Publication US 2023/0392992 A1, Dec. 7, 2023
Int. Cl. G01K 7/02 (2021.01); H10N 19/00 (2023.01)
CPC G01K 7/021 (2013.01) [H10N 19/00 (2023.02); G01K 7/028 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A system, comprising:
a metal tub structure formed in an integrated circuit (IC) structure;
a first metal component formed from a first metal, the first metal component formed in an opening defined by the metal tub structure, the first metal component including:
a first metal first junction element;
a first metal second junction element; and
a first metal bridge electrically connected between the first metal first junction element and the first metal second junction element; and
a second metal component formed from a second metal different than the first metal, the second metal component including:
a second metal first junction element electrically connected to the first metal first junction element to define a first thermocouple junction; and
a second metal second junction element electrically connected to the first metal second junction element to define a second thermocouple junction.