US 12,460,868 B2
Indirect evaporative cooling apparatus and cooling system including the same
Jungchul Kim, Daejeon (KR); Dong Ho Kim, Sejong-si (KR); Seok Ho Yoon, Daejeon (KR); and Young Kim, Daejeon (KR)
Assigned to KOREA INSTITUTE OF MACHINERY & MATERIALS, Daejeon (KR)
Filed by KOREA INSTITUTE OF MACHINERY & MATERIALS, Daejeon (KR)
Filed on Nov. 30, 2022, as Appl. No. 18/071,891.
Claims priority of application No. 10-2021-0169235 (KR), filed on Nov. 30, 2021.
Prior Publication US 2023/0168042 A1, Jun. 1, 2023
Int. Cl. F28D 5/02 (2006.01); F28D 1/03 (2006.01); F28F 3/08 (2006.01); F28F 25/10 (2006.01)
CPC F28D 5/02 (2013.01) [F28D 1/0366 (2013.01); F28F 3/08 (2013.01); F28F 25/10 (2013.01); F28F 2245/02 (2013.01); F28F 2245/04 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An indirect evaporative cooling apparatus comprising a plurality of evaporation modules each of which comprises a first module and a second module disposed to face the first module,
wherein each of a plurality of first modules and a plurality of second modules comprises:
a heat transfer plate configured to provide heat transfer;
a hydrophilic plate disposed to face the heat transfer plate and formed of a porous material capable of absorbing water;
a hydrophobic plate disposed to face the hydrophilic plate on an opposite side of the heat transfer plate and having pores, working fluid flowing through the hydrophobic plate on a side opposite to a side facing the hydrophilic plate; and
a water supply device configured to supply water to the hydrophilic plate,
wherein in each of the evaporation modules, a first flow path through which the working fluid flows is formed between the first module and the second module,
wherein a second flow path through which a cooling target fluid flows is formed between two of the evaporation modules adjacent to each other.