US 12,460,863 B2
Apparatus for treating a substrate
Ki-Moon Kang, Gyeonggi-do (KR); Hyun Goo Park, Gyeonggi-do (KR); and Hyo Won Yang, Seoul (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on May 26, 2022, as Appl. No. 17/825,420.
Prior Publication US 2023/0384029 A1, Nov. 30, 2023
Int. Cl. F26B 5/00 (2006.01)
CPC F26B 5/005 (2013.01) 20 Claims
OG exemplary drawing
 
1. A substrate treating apparatus comprising:
a chamber having a treating space therein;
a substrate support unit configured to support a substrate in the treating space; and
a fluid supply unit configured to supply a fluid in a supercritical state to the treating space,
wherein the fluid supply unit comprises:
a supply line provided at a top wall of the chamber; and
a discharge unit installed at the top wall of the chamber and configured to discharge a fluid to a substrate, and
wherein the discharge unit comprises:
a body having a discharge fluid channel for the fluid;
a nozzle plate provided at a discharge end of the body; and
a blocking plate within the discharge fluid channel and spaced apart from the nozzle plate.