US 12,460,844 B2
Ball seal for thermal sensor assembly of thermostatic expansion valve
Eric R. Coyle, Chesterfield, MO (US); and Dylan T. Yegge, Washington, MO (US)
Assigned to Parker-Hannifin Corporation, Cleveland, OH (US)
Appl. No. 18/693,355
Filed by Parker-Hannifin Corporation, Cleveland, OH (US)
PCT Filed Sep. 14, 2022, PCT No. PCT/US2022/076402
§ 371(c)(1), (2) Date Mar. 19, 2024,
PCT Pub. No. WO2023/107761, PCT Pub. Date Jun. 15, 2023.
Claims priority of provisional application 63/287,111, filed on Dec. 8, 2021.
Prior Publication US 2024/0426392 A1, Dec. 26, 2024
Int. Cl. F25B 41/335 (2021.01)
CPC F25B 41/335 (2021.01) 18 Claims
OG exemplary drawing
 
1. A thermal sensor assembly for a thermostatic expansion valve, the thermal sensor assembly comprising:
an enclosure forming an enclosed interior space containing a thermal sensing fluid, the enclosure having a charge opening configured for charging the thermal sensing fluid into the enclosure;
a ball arranged in the charge opening and having a sealing interface; and
a sealing surface layer located between a surface of the charge opening of the enclosure and the sealing interface of the ball forming a fluid seal between the enclosure at the charge opening and the ball;
wherein the sealing interface is formed by a first material and the sealing surface layer is formed by a second material having a greater softness than the first material such that the sealing surface layer conforms to the sealing interface and fluidly seals the thermal sensing fluid in the enclosed interior space of the enclosure at the charge opening,
wherein the sealing interface is formed by an outer surface of the ball, such that the sealing surface layer at the charge opening conforms to the outer surface of the ball, and
wherein the enclosure includes a third material as a substrate layer for the sealing surface layer, the third material of the substrate layer being harder than the second material of the sealing surface layer to enhance a strength of the enclosure.