US 12,460,809 B2
Lighting device with inner and outer heat sinks having different thermal conductivities
Ryan M. Bocock, Austin, TX (US); Robert Bollinger, Jr., Fogelsville, PA (US); Richard S. Camden, Coopersburg, PA (US); Kevin L. Gascho, Bethlehem, PA (US); Robert C. Newman, Jr., Emmaus, PA (US); and Peter W. Ogden, Jr., Austin, TX (US)
Assigned to Lutron Technology Company LLC, Coopersburg, PA (US)
Filed by Lutron Technology Company LLC, Coopersburg, PA (US)
Filed on Aug. 15, 2024, as Appl. No. 18/806,299.
Application 17/726,031 is a division of application No. 17/142,789, filed on Jan. 6, 2021, granted, now 11,333,343, issued on May 17, 2022.
Application 18/806,299 is a continuation of application No. 18/228,871, filed on Aug. 1, 2023, granted, now 12,104,776.
Application 18/228,871 is a continuation of application No. 17/726,031, filed on Apr. 21, 2022, granted, now 11,725,809, issued on Aug. 15, 2023.
Application 17/142,789 is a continuation of application No. 16/839,779, filed on Apr. 3, 2020, granted, now 10,935,228, issued on Mar. 2, 2021.
Claims priority of provisional application 63/000,613, filed on Mar. 27, 2020.
Claims priority of provisional application 62/879,159, filed on Jul. 26, 2019.
Claims priority of provisional application 62/828,791, filed on Apr. 3, 2019.
Prior Publication US 2024/0401791 A1, Dec. 5, 2024
Int. Cl. F21V 29/71 (2015.01); F21V 7/06 (2006.01); H05K 1/02 (2006.01); F21Y 113/13 (2016.01); F21Y 115/10 (2016.01)
CPC F21V 29/713 (2015.01) [F21V 7/06 (2013.01); H05K 1/0204 (2013.01); F21Y 2113/13 (2016.08); F21Y 2115/10 (2016.08); H05K 2201/10106 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A lighting device comprising:
a light-generation module comprising:
an emitter configured to emit light; and
a first heat sink defining a planar front surface having a circular periphery, the first heat sink further comprising a sidewall extending from the periphery of the front surface, the emitter thermally coupled to the front surface of the first heat sink;
a second heat sink defining a cavity in which the first heat sink is located, the second heat sink thermally coupled to the sidewall of the first heat sink;
a first printed circuit board attached to the front surface of the first heat sink; and
a second printed circuit board attached to a rear surface of the first heat sink, the second printed circuit board having a drive circuit for the emitter mounted thereto, a control circuit for controlling the drive circuit, and a wireless communication circuit configured to communicate wireless signals;
wherein the first heat sink is smaller in volume than the second heat sink, and the first heat sink is made from a first material that is more thermally conductive than a second material of the second heat sink.