| CPC C09K 5/14 (2013.01) [C01B 21/0648 (2013.01); H01L 23/3737 (2013.01)] | 18 Claims |
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1. A thermal interface filler comprising:
50 to 90% by weight of a microfiller, a plurality of refined and deagglomerated boron nitride nanotubes (BNNTs) and a residual h-BN allotrope fraction, and
when the refined and deagglomerated boron nitride nanotubes (BNNTs) and a residual h-BN allotrope fraction are dispersed in a polymer matrix material, less than 1% of any remaining agglomerations in the refined and deagglomerated BNNTs have two dimensions that exceed 300 μm, wherein:
the BNNTs having a residual boron particle content of less than 10% by weight;
the percentage of remaining agglomerations is determined from a remaining agglomeration size distribution based on visual inspection of an optical microscope image at 10x magnification of the refined and deagglomerated BNNTs when dispersed in the polymer matrix material;
the residual h-BN allotrope fraction of the refined and deagglomerated BNNTs is less than 30% as determined through visual analysis of an HR-SEM micrograph at 20,000× magnification of the refined and deagglomerated BNNTs; and
the microfiller is selected from the group consisting of a diamond powder, alumina spheres, an electrically conductive filler, copper particles, silver particles, graphite particles, aluminum nitride, aluminum oxide, silicon nitride, nanofibrillated cellulose, and combinations thereof.
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