US 12,460,091 B2
Board material processing composition, board material laminate, and method for manufacturing board material laminate
Toshinori Hattori, Tokyo (JP)
Assigned to M&HTechnical Research Institute Co., LTD., Tokyo (JP)
Filed by M&H Technical Research Institute Co., LTD., Tokyo (JP)
Filed on Nov. 28, 2023, as Appl. No. 18/520,889.
Application 18/520,889 is a continuation of application No. 18/555,049, previously published as PCT/JP2022/016238, filed on Mar. 30, 2022.
Claims priority of application No. 2021-073498 (JP), filed on Apr. 23, 2021.
Prior Publication US 2024/0093041 A1, Mar. 21, 2024
Int. Cl. C09D 5/18 (2006.01); B27D 1/04 (2006.01); B27K 3/20 (2006.01); B27K 3/32 (2006.01); B32B 21/04 (2006.01); B32B 21/13 (2006.01); B32B 21/14 (2006.01); C08K 3/013 (2018.01); C08K 3/015 (2018.01); C08K 3/36 (2006.01); C09D 1/00 (2006.01); C09D 5/14 (2006.01); C09D 5/16 (2006.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09D 191/06 (2006.01)
CPC C09D 5/18 (2013.01) [B27D 1/04 (2013.01); B27K 3/20 (2013.01); B27K 3/32 (2013.01); B32B 21/042 (2013.01); B32B 21/13 (2013.01); B32B 21/14 (2013.01); C09D 1/00 (2013.01); C09D 5/14 (2013.01); C09D 5/16 (2013.01); C09D 5/185 (2013.01); C09D 7/61 (2018.01); C09D 7/69 (2018.01); C09D 7/70 (2018.01); C09D 191/06 (2013.01); B27K 2240/30 (2013.01); B32B 2255/08 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2260/026 (2013.01); B32B 2260/046 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/7376 (2023.05); B32B 2419/00 (2013.01); C08K 3/013 (2018.01); C08K 3/015 (2018.01); C08K 3/36 (2013.01)] 6 Claims
 
1. A wood board material coating agent coated to a surface of a wood board material directly and inhibiting combustion of the wood board material due to heating, comprising:
silica sand, and
wax,
wherein the wood board material includes a bored hole in a surface of the wood board material,
wherein the wood board material coating agent is impregnated into an interior of the bored hole of the wood board material, and
wherein the inner wall of the bored hole is made of unmodified cellulose or lignin as constituent materials of the wood board material.