US 12,460,089 B2
Substrate coated with a thermal management material
Shreenath Anandakrishnan, Bangalore (IN); and Kuan-Ting Wu, Taipei (TW)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/915,152
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Jan. 8, 2021, PCT No. PCT/US2021/012634
§ 371(c)(1), (2) Date Sep. 28, 2022,
PCT Pub. No. WO2021/206775, PCT Pub. Date Oct. 14, 2021.
Prior Publication US 2023/0113973 A1, Apr. 13, 2023
Int. Cl. C09D 5/00 (2006.01); C09D 7/48 (2018.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09D 175/04 (2006.01)
CPC C09D 5/00 (2013.01) [C09D 7/48 (2018.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09D 175/04 (2013.01)] 15 Claims
 
1. A substrate coated with a thermal management material for an electronic device, wherein the thermal management material comprises:
a thermal conductive coat deposited on the substrate; and
a heat insulation coat deposited on the thermal conductive coat,
wherein the heat insulation coat comprises a plant root powder and a resin.