US 12,460,075 B2
Resin composition for molding and molded article
Tomohiro Horinouchi, Yamaguchi (JP); Mitsuo Matsumoto, Yamaguchi (JP); Ryota Yamasugi, Yamaguchi (JP); Yoshito Arai, Osaka (JP); Yasunari Kusaka, Osaka (JP); and Nami Nakajima, Osaka (JP)
Assigned to SEKISUI CHEMICAL CO., LTD., Osaka (JP)
Appl. No. 17/760,601
Filed by SEKISUI CHEMICAL CO., LTD., Osaka (JP)
PCT Filed Sep. 29, 2020, PCT No. PCT/JP2020/036995
§ 371(c)(1), (2) Date Mar. 15, 2022,
PCT Pub. No. WO2021/065941, PCT Pub. Date Apr. 8, 2021.
Claims priority of application No. 2019-179356 (JP), filed on Sep. 30, 2019.
Prior Publication US 2022/0348755 A1, Nov. 3, 2022
Int. Cl. C08L 27/24 (2006.01)
CPC C08L 27/24 (2013.01) [C08L 2205/02 (2013.01); C08L 2205/06 (2013.01)] 16 Claims
 
1. A resin composition for molding, comprising:
a chlorinated polyvinyl chloride resin;
a polyvinyl chloride resin; and
a melt additive,
the resin composition having an area ratio of a peak B observed in a range of 0.6 to 1.0 ppm to a peak A observed in a range of 9.5 to 10 ppm (Area of peak B/Area of peak A) of 1 to 1,000 when a 1H NMR spectrum is measured by solution NMR,
an amount of the polyvinyl chloride resin being 0.5 to 30 parts by mass based on 100 parts by mass of the chlorinated polyvinyl chloride resin,
the melt additive containing structural units represented by the following formulas (1) to (3),

OG Complex Work Unit Chemistry
wherein in the formula (2), X represents at least one selected from the group consisting of an alkyl group, a halogen group, a carboxy group, a hydroxy group, an acetyl group, an acryloyl group, a cyano group, an acrylamide group, a phenyl group, and an ether group, and
the melt additive having a weight average molecular weight of 1,000 to 1,000,000 and having a melting point of 60 to 150° C.